B S Solders

Other Details

B.S.Solder offers a range of No Clean Flux-501. which is an halide free rosin based low solids formulation. It is used in wave soldering of through hole, mixed technology and surface mount technology. The flux produces tack free surface with high surface insulation resistance and very little residue to interface with Electrical testing. The residues are non-corrosive and do not cause "greening" When in contact with copper or copper bearing alloys. It meets IPC and JSTD requirements.

Special Characteristics :

    Low viscosity liquid
    Completely non-, halide
    Passes copper mirror test as per Mil F-14256
    No visible flux residue after soldering
    Non corrosive residues, very safe residues
    Will not cause greening on exposed copper

Product Application

B. S. Solder N. C. Flux - 501 is designed for foam and spray and wave application. Flux solids can be monitored using N. C. Thinner - 501 by adjusting the flux density. For application which specifies cleaning of PCB board, solvent cleaner - 600 is recommenced. It removes even slight traces of flux residues.